Tasks and Responsibilities:

• process engineer in process development department
• proactive process development of optoelectronic devices for manufacturing specialized in damage free wafer thinning, polishing and the relevant supporting processes like lamination
• development and transfer of cost-efficient, fully automated and robust processes for high volume production
• process enhancements at existing semiconductor tools including the evaluation and introduction of new processes, materials and tools where appropriate in cooperation with external partners
• qualification and characterization of used materials/supplies
• cooperation with tool manufacturers and universities and research facilities

Qualifications:

• successfully completed master study of physics, mechanical engineering, microsystems technology, material science or equivalent degree program, Ph.D. advantageous
• several years working experience in an industrial environment like semiconductor industries such as the area of mechanical treatment of wafer, wafer thinning, chemical mechanical polishing and/ or etch technology preferred
• physical understanding of processes and knowledge in relevant analytical methods
• knowledge in usage of semiconductor materials
• strong communication skills and ability to work in a team, analytical thinking and creativity
• willingness to travel
• very good knowledge of English and German in verbal and written form