Waferbond and Laser Lift Off Process Engineer – Semiconductor
- Job Title
- Waferbond and Laser Lift Off Process Engineer – Semiconductor
- Job ID
- 27651271
- Location
- Regensburg, Bavaria, GERMANY, BY
- Other Location
- Description
-
Our multinational client, a leader in the manufacture of optoelectronic components, is in search of experts for their headquarters in Germany, specifically:
Waferbond and Laser Lift-Off Process Engineer – Semiconductor
Tasks and Responsibilities:
- Autonomous planning, execution and evaluation of experiments covering wafer-to-wafer bonding and/or laser lift-off processes within the frame of running product projects
- Development of novel frontend processes from scratch to production readiness in the area of adhesive and/or metallic wafer bonding and/or laser lift-off, including tool concepts, tool specification & procurement, tool & process setup, and process stabilization & transfer to production
- Exchange with others within the project and process network, especially project leader(s), key experts and counterparts in production
Qualifications
- Successfully accomplished studies of mechanical or electrical engineering, physics or similar classes, OR technical apprenticeship, and professional experience with semiconductor tools
- Experience in the area of wafer-to-wafer bonding and in the area of laser lift-off
- Joy with planning, performing, and evaluation of experiments
- Autonomous and thorough work skills
- Good team and communication skills
- German and English language skills paired with willingness to travel globally
- Required Skills
-
Master’s degree in Physics, Mechanical, Electrical Engg or related
Industry experience with semiconductor tools
Experience in the area of wafer-to-wafer bonding and in the area of laser lift-off
English & German language proficiency
Ability to travel globally
- Openings
- 1
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