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Waferbond and Laser Lift Off Process Engineer – Semiconductor

Job Title
Waferbond and Laser Lift Off Process Engineer – Semiconductor
Job ID
27651271
Location
Regensburg, Bavaria, GERMANY,  BY
Other Location
Description
Our multinational client, a leader in the manufacture of optoelectronic components, is in search of experts for their headquarters in Germany, specifically:
Waferbond and Laser Lift-Off Process Engineer – Semiconductor

Tasks and Responsibilities:

  • Autonomous planning, execution and evaluation of experiments covering wafer-to-wafer bonding and/or laser lift-off processes within the frame of running product projects
  • Development of novel frontend processes from scratch to production readiness in the area of adhesive and/or metallic wafer bonding and/or laser lift-off, including tool concepts, tool specification & procurement, tool & process setup, and process stabilization & transfer to production
  • Exchange with others within the project and process network, especially project leader(s), key experts and counterparts in production

Qualifications

  • Successfully accomplished studies of mechanical or electrical engineering, physics or similar classes, OR technical apprenticeship, and professional experience with semiconductor tools
  • Experience in the area of wafer-to-wafer bonding and in the area of laser lift-off
  • Joy with planning, performing, and evaluation of experiments
  • Autonomous and thorough work skills
  • Good team and communication skills
  • German and English language skills paired with willingness to travel globally
Required Skills

Master’s degree in Physics, Mechanical, Electrical Engg or related
Industry experience with semiconductor tools
Experience in the area of wafer-to-wafer bonding and in the area of laser lift-off
English & German language proficiency
Ability to travel globally
Openings
1

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CONTACTS

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